IEC 60749-19 Edition 1.1-2010 半导体器件.机械和气候试验方法.第19部分:模剪切强度

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【英文标准名称】:Semiconductordevices–Mechanicalandclimatictestmethods.Part19:Dieshearstrength
【原文标准名称】:半导体器件.机械和气候试验方法.第19部分:模剪切强度
【标准号】:IEC60749-19Edition1.1-2010
【标准状态】:现行
【国别】:国际
【发布日期】:2010-11-01
【实施或试行日期】:2010-11-01
【发布单位】:国际电工委员会(IX-IEC)
【起草单位】:IEC
【标准类型】:()
【标准水平】:()
【中文主题词】:
【英文主题词】:
【摘要】:ThispartofIEC60749determines(seenote)theintegrityofmaterialsandproceduresusedtoattachsemiconductordietopackageheadersorothersubstrates(forthepurposeofthistestmethod,theterm“semiconductordie”shouldbetakentoincludepassiveelements).Thistestmethodisgenerallyonlyapplicabletocavitypackagesorasaprocessmonitor.Itisnotapplicablefordieareasgreaterthan10mm2.Itisalsonotapplicabletoflipchiptechnologyortoflexiblesubstrates.NOTE1Thisdeterminationisbasedonameasureoftheforceappliedtothedieortotheelement,and,ifafailureoccurs,thetypeoffailureresultingfromtheapplicationofforceandthevisualappearanceoftheresidualdieattachmediumandtheheader/substratemetallization.NOTE2Incavitypackages,dieshearstrengthismeasuredinordertoassurethestrengthofthedieattachmentwithinthecavity.Innon-cavitypackages,suchasplasticencapsulatedpackages,diebondingisusedtopreventdiemovementuntiltheresinmouldiscompletelycured.Normally,specificationofthedieshearstrengthandtheminimumadhesionareaofdiebondaftermouldingareunnecessary,exceptinthefollowingcircumstances:–whenthedieneedstobeelectricallyconnectedtodiepad;–whenheatfromthedieneedstobediffusedthroughthediebond.
【中国标准分类号】:L40
【国际标准分类号】:31_080_01
【页数】:18P.;A4
【正文语种】: